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Laser Scribing

Our laser scribing solutions offer precise, controlled cuts for a variety of materials, including semiconductors and thin films. The process involves using a focused laser beam to create fine grooves or cuts, which can then be easily separated. Ideal for applications requiring clean, precise separations, our laser scribing technology ensures high accuracy and minimal material damage.
Laser scribing uses a laser to create precise, shallow cuts in materials, allowing for clean breaks or separations. This process is ideal for industries like electronics and solar panel manufacturing, where precision and control are critical. Our laser scribing systems are engineered to provide consistent, high-quality results, ensuring that each cut is accurate and reliable, with minimal material waste.

Laser Scribing Technology

advantages of laser Scribing

Non-Contact Process

The laser beam does not physically touch the material, reducing the risk of mechanical damage or contamination, which is especially useful for delicate or sensitive materials.

High Precision and Accuracy

Laser scribing allows for extremely precise cuts and markings, enabling detailed and intricate designs on a wide variety of materials with minimal waste.

Minimal Material Waste

Laser scribing produces clean cuts with minimal kerf width, resulting in less material waste compared to mechanical methods.

Versitality

Laser scribing can be used on a wide range of materials, including metals, ceramics, glass, and semiconductors, making it adaptable for various industries such as electronics, automotive, and solar panels.

types of laser Scribing

Thermal Laser Scribing

In this process, the laser heats the material to create thermal stress, which causes micro-cracks that guide the scribing line. This method is often used on brittle materials like glass or ceramics.

Ablative Laser Scribing

Ablative scribing removes material layer by layer with the laser, vaporizing or ablating it away to form a precise scribe. This method is commonly used in applications such as semiconductors, solar cells, and thin-film materials.

Continuous Wave Laser Scribing

A continuous laser beam is used to scribe materials in a steady stream, providing deep and continuous cuts. This method is suitable for thicker materials and applications where uninterrupted lines are required.

Cold Laser Scribing

This type of scribing uses lasers that emit pulses with extremely short durations (ultrafast lasers) to remove material without heating the surrounding area. Itā€™s ideal for delicate or heat-sensitive materials, ensuring minimal heat-affected zones.

Laser Assisted Mechanical Scribing

This method combines mechanical cutting with laser assistance for improved precision and reduced wear on cutting tools. The laser helps soften or pre-heat the material for easier mechanical scribing.

laser vs alternate

laser Scribing
Scribing Speed 90%
Scribing Quality & Precision 95%
Low Material Stress 90%
Intricate Design 100%
Consumable Savings 95%
Eco-Friendly 95%
Diamond Scribing
Scribing Speed 60%
Scribing Quality & Precision 75%
Low Material Stress 65%
Intricate Design 75%
Consumable Savings 50%
Eco-Friendly 70%
Mechanical Scribing
Scribing Speed 70%
Scribing Quality & Precision 70%
Low Material Stress 50%
Intricate Design 60%
Consumable Savings 60%
Eco-Friendly 65%
Chemical Etching
Scribing Speed 50%
Scribing Quality & Precision 90%
Low Material Stress 95%
Intricate Design 85%
Consumable Savings 40%
Eco-Friendly 70%

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